6 Layer Processors and Converters PCB with BGA

1.6L cell phone PCB; 2.good quality,reasonable price; 3.quicker delivery; 4.better logistic service; 5.UL,SGS,ROHS,ISO

We can manufacture PCBin higher quality, more competitive price, quicker delivery and better logistic service…Welcome to send us RFQ!

  

This form is of my company's process capacity for your reference, for more messages, pls contact with us freely!

Item	Specification
Material	FR-4 / Hi-Tg FR-4 / Lead free Materials(RoHS Compliant)/CEM-3/CEM-1/Aluminium
Layer	single layer,double layer,multi-layer(4-10)
Board Thickness	0.3mm-3.0mm,+/-0.1mm(tolerance)
Copper Thickness	1/2OZ-3OZ (35um to 105um),+/-8um(tolerance),purity 99.5%
Impedance Control	±10%
Bow and Twist MAX.	0.75%(SMT)
Anti-strip	0.88N/mm
Resistance	≤20Ω
Reactance	500V
Min. Value
Min. Trace/Space Width	6 mil,+/-0.15mm(tolerance)
SMD Pitch	10 mil
BGA Pitch	20 mil
Min Pad Space	4mil(SMT)
Plating Copper Thickness	15um
Hole
Hole Size	0.25mm--6.2mm
Hole Position Tolerance	±0.1mm
PTH/NPTH Tolerance	±0.15mm(dia.=0.4-1.4mm)
Pad Tolerance	±0.1mm(dia.≥0.6mm)
Pad to hole/to pad Tolerance	±0.05mm/±0.2mm
Solder Mask
Pad no Open	soldermask must cover all on both side, reject tin on pad
Pad Open	reject soldermask inside the hole on both side
Solder Mask Thickness	0.7mil,raised H≤0.05
Colour	green,blue,red,yellow,black,white(LPI/MATT.,UL 94 V0 approved)
Surface Finish
HAL	tin height≤0.05mm
ENIG	Nickel  3-7um,gold:0.5-0.7um
OSP/flash gold	0.2-0.5um
Pealable mask	cover all on pad,thickness≥0.20mm
Carbon Ink	cover all on trace,Value≤30Ω
Outline
Outline Tolerance	±0.2mm
Beveling	30°,45°
V-cut position/depth	±0.2mm(length≤100mm)/±0.2mm
Punch	±0.1mm
E-testing pass percent	97% pass for the first time,+/-2%(tolerance)
Certificate	SGS,ISO,ROHS,UL,

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6 Layer Processors and Converters PCB with BGA